BAY AREA AIR QUALITY
MANAGEMENT DISTRICT |
Source Category
| Source: | Wave Solder Operations: Flux Application | Revision: | 1 |
| Document #: | 179A.1 | ||
| Class: | All | Date: | 12/16/91 |
Determination
POLLUTANT |
BACT 1. Technologically Feasible/ Cost Effective 2. Achieved in Practice |
TYPICAL TECHNOLOGY |
| POC | 1. Use of "no
clean" fluxes that do not require finger cleaning after soldering, enclosure of all
wave solder operations, minimization of extrance/exit areas, and vent to control system w/
overall capture/ destruction efficiency >90%a 2. Use of "no clean" fluxes that do not require finger cleaning after soldering, covering of flux bath when applicator is not in operation, and minimization of entrance/exit areas.a |
1. Collection System
Vented to Carbon Adsorber or Afterburnera 2. BAAQMD Approved Design and Operationa |
| NOx | 1. n/a 2. n/a |
1. n/a 2. n/a |
| SO2 | 1. n/a 2. n/a |
1. n/a 2. n/a |
| CO | 1. n/a 2. n/a |
1. n/a 2. n/a |
| PM10 | 1. n/a 2. n/a |
1. n/a 2. n/a |
| NPOC | 1. Use of "no
clean" fluxes that do not require finger cleaning after soldering, enclosure of all
wave solder operations, minimization of extrance/exit areas, and vent to control system w/
overall capture/destruction efficiency >90%a 2. Use of "no clean" fluxes that do not require finger cleaning after soldering, covering of flux bath when applicator is not in operation, and minimization of entrance/exit areaa |
1. Collection System
Vented to Carbon Adsorber or Afterburnera 2. BAAQMD Approved Design and Operationa |
References
| a. BAAQMD A #8337 |